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US 6,072,239 AGranted
Device having resin package with projections
AssigneeFujitsu Limited
InventorsYoshiyuki Yoneda, Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera, Junichi Kasai
Life of this patent
Estimating the term…
Abstract
A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic films.
Claims14
A device comprising:
- a chip;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package;
- metallic films respectively provided in continuous surface contact with said resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- wherein said resin projections have surfaces which are parallel to the mount-side surface of the resin package, and
- wherein the metallic films are formed on the entire surfaces of the resin projections.
4 more elements
A device comprising:
- a chip;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and laterally extending from at least one side surface of the resin package;
- metallic films respectively provided in continuous surface contact with said resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- wherein said resin projections have surfaces which are parallel to the mount-side surface of the resin package, and
- wherein the metallic films are formed on the entire surfaces of the resin projections.
4 more elements
A device comprising:
- a chip;
- a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and being substantially flush with a side surface of the resin package;
- metallic films respectively provided in continuous surface contact with said resin projections;
- and
- connecting parts electrically connecting electrode pads of said chip and the metallic films,
- wherein said resin projections have surfaces which are parallel to the mount-side surface of the resin package, and
- wherein the metallic films are formed on the entire surfaces of the resin projections.
4 more elements
Dependencies are inferred from the claim text.