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US 6,835,898 B2Granted
Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
AssigneeFormFactor, Inc.
InventorsBenjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
Life of this patent
Estimating the term…
Abstract
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.
Claims5
Electrical connection between two electronic components, comprising:
- a conductive path consisting essentially of a metallic coating having at least one electrically-conductive layer, said metallic coating disposed on an elongate member, said coating extending between and interconnecting two electronic components, wherein said elongate member comprises a first material, and said metallic coating comprises a second material that is more resilient than said first material,
- wherein the coating is a plating having at least one layer, and
- the plating is a material selected from the group comprising copper, cobalt, iron, nickel, and their alloys.
Dependencies are inferred from the claim text.