H10W 72/557
Multiple bond wires having different materials
Official title: {Multiple bond wires having different materials}
H10W72/557 (Multiple bond wires having different materials) appears on 66 US grants and 71 published applications in this corpus.
Search patents in H10W- Granted patents
- 66
- Published applications
- 71
- Assignees
- 28
- Inventors
- 118
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 2 | 0 |
| 2008 | 0 | 3 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 2 |
| 2013 | 2 | 5 |
| 2014 | 4 | 5 |
| 2015 | 5 | 2 |
| 2016 | 5 | 5 |
| 2017 | 6 | 4 |
| 2018 | 3 | 4 |
| 2019 | 4 | 5 |
| 2020 | 5 | 5 |
| 2021 | 4 | 3 |
| 2022 | 3 | 8 |
| 2023 | 4 | 8 |
| 2024 | 4 | 3 |
| 2025 | 4 | 3 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Transistor device, semiconductor package and method of fabricating a transistor device18 Aug 2026US 12,713,671 B2Infineon Technologies Austria AG
- Semiconductor device package comprising a plurality of leads wherein a first lead has a pad surface larger than a second lead6 Jan 2026US 12,519,040 B2Rohm Co., Ltd.
- Semiconductor device2 Dec 2025US 12,489,047 B2Rohm Co., Ltd.
- Multi-chip device with gate redistribution structure4 Nov 2025US 12,463,173 B2Infineon Technologies Austria AG
- Semiconductor device19 Feb 2026US 2026/0053029 A1Rohm Co., Ltd.
- Electronic component and device including the electronic component5 Jun 2025US 2025/0183220 A1Canon Kabushiki Kaisha
- Semiconductor device and method for manufacturing semiconductor device27 Feb 2025US 2025/0070051 A1Rohm Co., Ltd.
- Semiconductor device23 Jan 2025US 2025/0029898 A1Rohm Co., Ltd.
- Semiconductor device19 Dec 2024US 2024/0421022 A1Rohm Co., Ltd.
Most cited
By later US patents
- Ion-sensitive electrode and processes for making the same162US 4,133,735 AThe Board of Regents of the University of Washington · 1979
- Direct current sense lead23US 4,818,895 A1989
- Semiconductor device using bonding wires of different materials14US 5,173,762 AKabushiki Kaisha Toshiba · 1992
- Electronic component incorporating solder fuse wire12US 5,644,281 ARohm Co., Ltd. · 1997
- Semiconductor device10US 9,397,037 B2Rohm Co., Ltd. · 2016