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US 9,397,037 B2Granted
Semiconductor device
AssigneeRohm Co., Ltd.
InventorsShoji Yasunaga, Akihiro Koga
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.
Claims20
A semiconductor device comprising:
- semiconductor elements;
- a lead including a plurality of island portions on which the semiconductor elements are mounted;
- a common heat dissipation member for dissipating heat from each of the island portions, the common heat dissipation member having a common continuous flat surface;
- a bonding layer bonding the common continuous flat surface of the common heat dissipation member to each of the island portions;
- and
- a sealing resin covering the semiconductor elements, the island portions and a part of the common heat dissipation member;
- wherein the bonding layer includes individual regions provided for the island portions, respectively, the individual regions being spaced apart from each other on the common continuous flat surface,
- the sealing resin fills a space formed between adjacent ones of the individual regions, thereby being held in direct contact with the common continuous flat surface, and
- the bonding layer is formed of an adhesive made of a resin, the bonding layer being held in direct contact with the common heat dissipation member.
6 more elements
Dependencies are inferred from the claim text.