Semiconductor device

A semiconductor device comprising:

• a first lead, a second lead, and a third lead including a base that includes a first surface facing a first side in a thickness direction;
• a semiconductor element mounted on the first surface;
• a plurality of wires each having one end connected to the semiconductor element;
• and
• a sealing resin covering the semiconductor element, and a portion of each of the first lead, the second lead, and the third lead, and the plurality of wires,
• wherein the first lead includes a first pad portion, and a first terminal portion connected to the first pad portion and used for measuring a temperature,
• the second lead includes a second pad portion, and a second terminal portion connected to the second pad portion and used for measuring a temperature,
• the third lead includes a third terminal portion connected to the base,
• the semiconductor element includes an element obverse surface facing the first side in the thickness direction and a first electrode arranged on the element obverse surface,
• the plurality of wires include a first wire and a second wire that are made of metals having different thermoelectric powers,
• the first wire is connected to the first electrode and the first pad portion, and
• the second wire is connected to the first electrode and the second pad portion.