Semiconductor device and method for manufacturing semiconductor device

A semiconductor device comprising:

• a semiconductor element having an element front surface and an element back surface facing away from each other in a first direction, the semiconductor element further having an element side surface connected to the element front surface and the element back surface;
• a die pad on which the semiconductor element is mounted;
• a lead spaced apart from the die pad;
• a conductive member bonded to the lead, the conductive member and electrically connecting the semiconductor element and the lead;
• a sealing resin covering part of the lead and the semiconductor element;
• a conductive bonding material bonding the semiconductor element and the die pad;
• and
• a lead-side covering member,
• wherein the semiconductor element includes a first front-surface electrode formed on the element front surface,
• the conductive member includes a first wire bonded to the first front-surface electrode and the lead to electrically connect the first front-surface electrode and the lead, and
• the lead-side covering member covers the bonded region where the first wire and the lead are bonded.