H10W 72/555
Of outermost layers of multilayered bond wires
Official title: {of outermost layers of multilayered bond wires, e.g. material of a coating}
H10W72/555 (Of outermost layers of multilayered bond wires) appears on 651 US grants and 658 published applications in this corpus.
Search patents in H10W- Granted patents
- 651
- Published applications
- 658
- Assignees
- 227
- Inventors
- 1,248
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 9 | 0 |
| 1998 | 15 | 0 |
| 1999 | 16 | 0 |
| 2000 | 26 | 0 |
| 2001 | 21 | 7 |
| 2002 | 13 | 21 |
| 2003 | 14 | 19 |
| 2004 | 14 | 21 |
| 2005 | 15 | 23 |
| 2006 | 17 | 25 |
| 2007 | 10 | 26 |
| 2008 | 11 | 24 |
| 2009 | 9 | 28 |
| 2010 | 23 | 28 |
| 2011 | 20 | 28 |
| 2012 | 26 | 27 |
| 2013 | 20 | 22 |
| 2014 | 27 | 30 |
| 2015 | 25 | 36 |
| 2016 | 28 | 32 |
| 2017 | 29 | 45 |
| 2018 | 40 | 30 |
| 2019 | 32 | 30 |
| 2020 | 26 | 27 |
| 2021 | 13 | 22 |
| 2022 | 22 | 28 |
| 2023 | 20 | 24 |
| 2024 | 20 | 29 |
| 2025 | 17 | 15 |
| 2026 | 19 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding wire for semiconductor devices15 Sep 2026US 12,740,468 B2Nippon Micrometal Corporation
- Aluminum bonding wire coated by photo-curing polymer, preparation method, and application therefor8 Sep 2026US 12,729,454 B2China Academy of Machinery Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Wire bonds for galvanic isolation device18 Aug 2026US 12,713,629 B2Texas Instruments Incorporated
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor device and method for manufacturing semiconductor device6 Aug 2026US 2026/0231813 A1Kioxia Corporation
- Microelectronic device package with integrated trench capacitor dies and semiconductor device die6 Aug 2026US 2026/0231818 A1Texas Instruments Incorporated
- Microelectronics device package with isolation and micro-transformer6 Aug 2026US 2026/0231819 A1Texas Instruments Incorporated
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Nanowires, nanostructures and devices fabricated therefrom394US 6,882,051 B2The Regents of the University of California · 2005
- Method of fabricating an interconnection element335US 6,336,269 B12002
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998