H10W 72/552
Comprising metals or metalloids
Official title: {comprising metals or metalloids, e.g. silver}
H10W72/552 (Comprising metals or metalloids) appears on 15,048 US grants and 13,848 published applications in this corpus.
Search patents in H10W- Granted patents
- 15,048
- Published applications
- 13,848
- Assignees
- 2,192
- Inventors
- 19,988
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 27 | 0 |
| 1977 | 23 | 0 |
| 1978 | 18 | 0 |
| 1979 | 14 | 0 |
| 1980 | 22 | 0 |
| 1981 | 15 | 0 |
| 1982 | 24 | 0 |
| 1983 | 23 | 0 |
| 1984 | 26 | 0 |
| 1985 | 43 | 0 |
| 1986 | 49 | 0 |
| 1987 | 62 | 0 |
| 1988 | 52 | 0 |
| 1989 | 82 | 0 |
| 1990 | 96 | 0 |
| 1991 | 133 | 0 |
| 1992 | 161 | 0 |
| 1993 | 137 | 0 |
| 1994 | 175 | 0 |
| 1995 | 173 | 0 |
| 1996 | 192 | 0 |
| 1997 | 232 | 0 |
| 1998 | 317 | 0 |
| 1999 | 338 | 0 |
| 2000 | 391 | 0 |
| 2001 | 515 | 285 |
| 2002 | 542 | 771 |
| 2003 | 592 | 703 |
| 2004 | 646 | 706 |
| 2005 | 536 | 817 |
| 2006 | 568 | 713 |
| 2007 | 511 | 756 |
| 2008 | 442 | 789 |
| 2009 | 466 | 818 |
| 2010 | 634 | 834 |
| 2011 | 756 | 779 |
| 2012 | 670 | 704 |
| 2013 | 678 | 641 |
| 2014 | 663 | 635 |
| 2015 | 593 | 634 |
| 2016 | 605 | 493 |
| 2017 | 507 | 413 |
| 2018 | 406 | 371 |
| 2019 | 356 | 315 |
| 2020 | 299 | 320 |
| 2021 | 231 | 309 |
| 2022 | 255 | 334 |
| 2023 | 219 | 238 |
| 2024 | 249 | 233 |
| 2025 | 179 | 150 |
| 2026 | 105 | 87 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Semiconductor module6 Oct 2026US 12,757,768 B2Shindengen Electric Manufacturing Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor device29 Sep 2026US 12,751,333 B2Rohm Co., Ltd.
- Signal transmission device and insulated module29 Sep 2026US 12,751,339 B2Rohm Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor device24 Sep 2026US 2026/0293686 A1Rohm Co., Ltd.
- Semiconductor structure, fabrication method and package structure thereof17 Sep 2026US 2026/0283047 A1Vanguard International Semiconductor Corporation
- Semiconductor device3 Sep 2026US 2026/0262537 A1Rohm Co., Ltd.
Most cited
By later US patents
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Implantable microstimulator1,104US 5,193,539 AAlfred E. Mann Foundation for Scientific Research · 1993
- Mold tool for an optoelectronic element1,037US 6,830,711 B2Masimo Corporation · 2004
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999
- Active programmable electronic devices for molecular biological analysis and diagnostics1,006US 5,605,662 ANanogen, Inc. · 1997