H10W 72/5525
Comprising copper [cu]
Official title: {comprising copper [Cu]}
H10W72/5525 (Comprising copper [cu]) appears on 4,311 US grants and 4,644 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,311
- Published applications
- 4,644
- Assignees
- 854
- Inventors
- 6,860
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 8 | 0 |
| 1985 | 10 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 9 | 0 |
| 1989 | 14 | 0 |
| 1990 | 23 | 0 |
| 1991 | 34 | 0 |
| 1992 | 36 | 0 |
| 1993 | 20 | 0 |
| 1994 | 31 | 0 |
| 1995 | 29 | 0 |
| 1996 | 34 | 0 |
| 1997 | 16 | 0 |
| 1998 | 39 | 0 |
| 1999 | 43 | 0 |
| 2000 | 62 | 0 |
| 2001 | 94 | 49 |
| 2002 | 73 | 104 |
| 2003 | 88 | 95 |
| 2004 | 95 | 91 |
| 2005 | 79 | 138 |
| 2006 | 97 | 114 |
| 2007 | 81 | 134 |
| 2008 | 70 | 198 |
| 2009 | 90 | 216 |
| 2010 | 141 | 238 |
| 2011 | 213 | 222 |
| 2012 | 181 | 243 |
| 2013 | 197 | 242 |
| 2014 | 218 | 252 |
| 2015 | 243 | 289 |
| 2016 | 279 | 246 |
| 2017 | 245 | 241 |
| 2018 | 220 | 224 |
| 2019 | 190 | 182 |
| 2020 | 173 | 189 |
| 2021 | 141 | 197 |
| 2022 | 158 | 230 |
| 2023 | 149 | 165 |
| 2024 | 171 | 164 |
| 2025 | 124 | 114 |
| 2026 | 70 | 67 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor device29 Sep 2026US 12,751,333 B2Rohm Co., Ltd.
- Signal transmission device and insulated module29 Sep 2026US 12,751,339 B2Rohm Co., Ltd.
- Semiconductor module15 Sep 2026US 12,740,453 B2Shindengen Electric Manufacturing Co., Ltd.
- Bonding wire for semiconductor devices15 Sep 2026US 12,740,468 B2Nippon Micrometal Corporation
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor structure, fabrication method and package structure thereof17 Sep 2026US 2026/0283047 A1Vanguard International Semiconductor Corporation
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Substrate processing and packaging20 Aug 2026US 2026/0247989 A1Texas Instruments Incorporated
Most cited
By later US patents
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999
- Lighting device and lighting method856US 7,213,940 B1LED Lighting Fixtures, Inc. · 2007
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Microstimulator employing improved recharging reporting and telemetry techniques440US 7,437,193 B2Boston Scientific Neuromodulation Corporation · 2008