Semiconductor module
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsYuji Morinaga, Junya Yuguchi
Life of this patent
Estimating the term…
Loading patent…
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsYuji Morinaga, Junya Yuguchi
Estimating the term…
In a semiconductor module, first and third chips are disposed symmetrically with respect to a center line. Second and fourth chips are disposed symmetrically with respect to the center line. First and third wiring patterns are disposed symmetrically with respect to the center line. Second and fourth wiring patterns are disposed symmetrically with respect to the center line. Two intermediate points are disposed symmetrically with respect to the center line. Two second power terminals are disposed symmetrically with respect to the center line. A fifth wiring pattern and a first power terminal are disposed symmetrically with respect to the center line. The intermediate points are adjacent to each other on one side of the module. All power terminals are on the other side of the module. The first power terminal is above the fifth wiring pattern in a non-contact state and connects the first and third wiring patterns.
A semiconductor module comprising:
Dependencies are inferred from the claim text.