H10W 72/5528
Intermetallic compounds
Official title: {Intermetallic compounds}
H10W72/5528 (Intermetallic compounds) appears on 115 US grants and 119 published applications in this corpus.
Search patents in H10W- Granted patents
- 115
- Published applications
- 119
- Assignees
- 52
- Inventors
- 222
- Latest grant
- 18 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 4 |
| 2003 | 4 | 3 |
| 2004 | 2 | 2 |
| 2005 | 0 | 4 |
| 2006 | 1 | 8 |
| 2007 | 1 | 4 |
| 2008 | 4 | 3 |
| 2009 | 6 | 2 |
| 2010 | 2 | 3 |
| 2011 | 4 | 4 |
| 2012 | 4 | 11 |
| 2013 | 4 | 4 |
| 2014 | 4 | 7 |
| 2015 | 4 | 6 |
| 2016 | 11 | 8 |
| 2017 | 9 | 12 |
| 2018 | 9 | 6 |
| 2019 | 8 | 6 |
| 2020 | 7 | 6 |
| 2021 | 2 | 3 |
| 2022 | 6 | 6 |
| 2023 | 2 | 4 |
| 2024 | 5 | 1 |
| 2025 | 3 | 0 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package substrate with groove on die pad18 Nov 2025US 12,476,204 B2Texas Instruments Incorporated
- Bonding wire for semiconductor devices9 Sep 2025US 12,412,864 B2Nippon Micrometal Corporation
- Copper alloy bonding wire for semiconductor devices13 May 2025US 12,300,658 B2Nippon Micrometal Corporation
- Method for predicting reliability of semiconductor device26 Nov 2024US 12,152,997 B2Renesas Electronics Corporation
- Method for detecting coverage rate of intermetallic compound9 Jul 2024US 12,031,920 B2Weifang Goertek Microelectronics Co., Ltd.
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
- Copper alloy bonding wire for semiconductor devices9 Apr 2026US 2026/0097454 A1Nippon Micrometal Corporation
- Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die8 Feb 2024US 2024/0047381 A1Texas Instruments Incorporated
- Semiconductor package assembly and method of manufacturing4 May 2023US 2023/0137612 A1Nexperia B. V.
- Semiconductor device and method for packaging13 Apr 2023US 2023/0110402 A1NXP USA, Inc.
Most cited
By later US patents
- Method of improving copper interconnects of semiconductor devices for bonding109US 6,544,880 B1Micron Technology, Inc. · 2003
- Thin chip-size integrated circuit package71US 6,091,140 ATexas Instruments Incorporated · 2000
- Copper bonding wire for semiconductor device and bonding structure thereof50US 8,653,668 B2Nippon Micrometal Corporation · 2014
- Method of forming an integrated circuit device package using a plastic tape as a base43US 6,247,229 B1Ankor Technology, Inc. · 2001
- Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion40US 9,508,622 B2Freescale Semiconductor, Inc. · 2016