Semiconductor device and method for packaging
AssigneeNXP USA, Inc.
InventorsYou Ge, Meng Kong Lye, Zhijie Wang
Life of this patent
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Abstract
A method of packaging a semiconductor device includes: bonding a ball at an end of a bond wire to a bond pad of a semiconductor device die in an aperture of a shielding layer of the semiconductor device; and sealing the part of the bond pad exposed by the aperture of the shielding layer by deforming the ball of the bond wire to fill the aperture of the shielding layer. The aperture of the shielding layer includes an edge wall, and exposes a part of the bond pad. The shielding layer covers a remaining part of the bond pad. The aperture of the shielding layer is completely filled with the ball of the bond wire, thereby deforming the edge wall of the shielding layer.
Claims20
A method of packaging a semiconductor device, comprising:
- bonding a ball at an end of a bond wire to a bond pad of a semiconductor device die in an aperture of a shielding layer of the semiconductor device;
- wherein the aperture of the shielding layer comprises an edge wall, and is configured to expose a part of the bond pad, and the shielding layer is configured to cover a remaining part of the bond pad;
- and
- sealing the part of the bond pad exposed by the aperture of the shielding layer by deforming the ball of the bond wire to fill the aperture of the shielding layer, such that the aperture of the shielding layer is completely filled with the ball of the bond wire, thereby deforming the edge wall of the shielding layer.
A semiconductor device comprising:
- a device die comprising a bond pad, and a shielding layer covering a part of the bond pad and having an aperture over a remaining part of the bond pad;
- a connector having an end electrically and mechanically connected to the bond pad within the aperture, wherein the end of the connector contacts an edge wall of the aperture;
- and
- molding compound configured to encapsulate the device die and the end of the connector;
- wherein the molding compound is remote from the bond pad.
A semiconductor device comprising:
- a substrate having a surface;
- at least a bond pad on the surface of the substrate;
- and
- a shielding layer on the surface, wherein the shielding layer comprises an aperture to expose a part of the bond pad, and the shielding layer is configured to cover a remaining part of the bond pad;
- and wherein
- the shielding layer is deformable such that the aperture is expandable to receive an end of a bond wire to be bonded to the bond pad.
Dependencies are inferred from the claim text.