Method for predicting reliability of semiconductor device
AssigneeRenesas Electronics Corporation
InventorTakuo Funaya
Life of this patent
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Abstract
A reliability prediction method includes: calculating a change of each of a plurality of alloy phases at a bonding portion between an electrode pad and a bonding wire; setting a generation of a metal oxide phase caused by a corrosion reaction, based on an initial crack structure of the bonding portion; calculating an elastic strain energy at each of specified portions of the bonding portion; setting a progress of a crack, based on the elastic strain energy at each of the specified portions; and predicting a lifetime of the semiconductor device, based on a length of the crack due to the progress of the crack.
Claims11
A method for predicting a reliability of a semiconductor device, comprising:
- (a) inputting a processed image at a bonding portion between an electrode pad and a bonding wire, the electrode pad being mainly comprised of aluminum formed on a semiconductor chip, and the bonding wire being mainly comprised of copper;
- (b) calculating a change of each of a plurality of alloy phases at the bonding portion, by applying a phase field method to the processed image;
- (c) setting a metal oxide phase at a region of a specific alloy phase, if there are a crack and the specific alloy phase that is in contact with the crack, in the processed image in which the change of each of the plurality of alloy phases calculated in the (b) is reflected, the crack being in contact with the region;
- (d) calculating an elastic strain energy at each of specified portions of the bonding portion, based on a calculating result of the change of each of the plurality of alloy phases in the (b) and a setting result of the metal oxide phase in the (c);
- (e) setting a progress of the crack at the bonding portion, based on the elastic strain energy calculated in the (d);
- and
- (f) predicting a lifetime of the semiconductor device, based on the progress of the crack set in the (e).
Dependencies are inferred from the claim text.