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US 12,031,920 B2Granted
Method for detecting coverage rate of intermetallic compound
AssigneeWeifang Goertek Microelectronics Co., Ltd.
InventorsDingguo Zhong, Dewen Tian, Qinglin Song
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Abstract
Disclosed is a method for detecting coverage rate of an intermetallic compound, the method comprising putting a chip subjected to wire bonding into a mixed reagent of fuming nitric acid and fuming sulfuric acid for soaking, wherein the chip subjected to wire bonding comprises a silver wire and an aluminum; taking out the chip after the silver wire is removed; and detecting the coverage rate of an intermetallic compound on the aluminum pad.
Claims10
A method for detecting a coverage rate of an intermetallic compound, comprising:
- putting a chip subjected to wire bonding into a mixed reagent of fuming nitric acid and fuming sulfuric acid for soaking, wherein the chip subjected to wire bonding comprises a silver wire and an aluminum pad;
- taking out the chip after the silver wire is removed;
- and
- detecting the coverage rate of an intermetallic compound on the aluminum pad.
1 more element
Dependencies are inferred from the claim text.