Method of forming an integrated circuit device package using a plastic tape as a base

A method of forming an integrated circuit device package comprising:

• providing a plastic sheet having a first surface;
• attaching a metal sheet to the first surface of the plastic sheet;
• patterning the metal sheet to form a die pad and a plurality of leads adjacent to the die pad, wherein the die pad and the leads so formed have a first surface, a second surface opposite the first surface and on the first surface of the plastic sheet, and peripheral side surfaces, and the side surfaces of the die pad and the leads include a reentrant portion and asperities;
• placing an integrated circuit device on the first surface of the die pad;
• conductively connecting the integrated circuit device to one or more of the leads;
• applying an encapsulating material so that the integrated circuit device and the first surface of the plastic sheet are covered by the encapsulating material and the reentrant portion and the asperities of the side surfaces of the die pad and the leads are covered with the encapsulating material;
• and
• removing the plastic sheet thereby exposing the second surface of the die pad and the leads.

A method of forming a plurality of integrated circuit device packages comprising:

• providing a plastic sheet having a first surface;
• applying a metal layer on the first surface of the plastic sheet;
• patterning the metal layer so as to form an array of package sites, wherein each package site formed includes a die pad and a plurality of leads adjacent to the die pad, wherein the die pad and the leads so formed have a first surface, a second surface opposite the first surface and on the first surface of the plastic sheet, and peripheral side surfaces, and the side surfaces of the die pad and the leads include a reentrant portion and asperities;
• placing an integrated circuit device on the first surface of each die pad of the array;
• electrically connecting the integrated circuit device to the leads adjacent to the die pad on which the integrated circuit device is placed;
• applying an encapsulating material onto the away and the first surface of the plastic sheet so that the package sites are encapsulated and the reentrant portion and asperities of the die pad and the leads are covered with the encapsulating material;
• removing the plastic sheet from the encapsulated array;
• and
• separating the package sites to form the packages from the encapsulated array, wherein the second surface of the die pad and the leads of each package is exposed at an external surface of the package.

A method of forming a plurality of integrated circuit device packages comprising:

• providing a plastic sheet having a first surface;
• attaching a metal sheet to the first surface of the plastic sheet;
• patterning the metal sheet so as to form an array of package sites, wherein each package site formed includes a die pad and a plurality of leads adjacent to the die pad;
• coining the die pad and the leads of the package sites so as to form a lip having asperities thereon at a peripheral side surface of the die pad and the leads;
• placing an integrated circuit device on each die pad of the array;
• conductively connecting the integrated circuit device to the leads adjacent to the die pad on which the integrated circuit device is placed;
• molding an encapsulating material onto the array and the first surface of the plastic sheet so that each package site is encapsulated and the encapsulating material fills in under said lip;
• removing the plastic sheet;
• and
• separating the package sites to form the packages from the encapsulated array, wherein a surface of the die pad and the leads of each package is exposed.

A method of forming an integrated circuit device package comprising:

• providing a plastic sheet having a first surface;
• attaching a metal sheet to the first surface of the first plastic sheet;
• patterning the metal sheet to form a die pad and a plurality of leads adjacent to the die pad;
• coining the die pad and leads so as to form a lip having asperities thereon at a peripheral side surface of the die pad and leads;
• placing an integrated circuit device on the die pad;
• conductively connecting the integrated circuit device to one or more of the leads;
• molding an encapsulating material so that the integrated circuit device and the first surface of the plastic sheet are covered by the encapsulating material;
• and
• removing the plastic sheet.