Semiconductor package assembly and method of manufacturing

Abstract

A semiconductor package assembly and method of manufacturing is provided. The assembly includes a semiconductor package and a moulding resin case encapsulating the semiconductor package. The package includes a lead frame having a first frame side and a second frame side opposite to the first frame side; a silicon die structure having a first die side and a second die side opposite to the first side, the silicon die structure being mounted with its second die side on the first frame side of the lead frame; one or more bond wires electrically connecting the silicon die structure with the lead frame; as well as a coating layer covering the semiconductor package from the encapsulating moulding resin case, the coating layer being composed of two or more different amorphous layer coatings. The use of a coating layer covering the complete semiconductor package forming the encapsulating moulding resin case prevents any corrosion.

Dependencies are inferred from the claim text.