H10W 72/5522
Comprising gold [au]
Official title: {comprising gold [Au]}
H10W72/5522 (Comprising gold [au]) appears on 11,511 US grants and 10,465 published applications in this corpus.
Search patents in H10W- Granted patents
- 11,511
- Published applications
- 10,465
- Assignees
- 1,783
- Inventors
- 15,813
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 16 | 0 |
| 1977 | 20 | 0 |
| 1978 | 16 | 0 |
| 1979 | 8 | 0 |
| 1980 | 19 | 0 |
| 1981 | 13 | 0 |
| 1982 | 17 | 0 |
| 1983 | 19 | 0 |
| 1984 | 19 | 0 |
| 1985 | 18 | 0 |
| 1986 | 34 | 0 |
| 1987 | 35 | 0 |
| 1988 | 41 | 0 |
| 1989 | 66 | 0 |
| 1990 | 68 | 0 |
| 1991 | 104 | 0 |
| 1992 | 119 | 0 |
| 1993 | 97 | 0 |
| 1994 | 141 | 0 |
| 1995 | 131 | 0 |
| 1996 | 139 | 0 |
| 1997 | 177 | 0 |
| 1998 | 247 | 0 |
| 1999 | 274 | 0 |
| 2000 | 318 | 0 |
| 2001 | 431 | 245 |
| 2002 | 463 | 639 |
| 2003 | 492 | 578 |
| 2004 | 540 | 555 |
| 2005 | 443 | 653 |
| 2006 | 460 | 569 |
| 2007 | 419 | 602 |
| 2008 | 359 | 613 |
| 2009 | 355 | 645 |
| 2010 | 497 | 624 |
| 2011 | 594 | 587 |
| 2012 | 511 | 517 |
| 2013 | 518 | 459 |
| 2014 | 489 | 476 |
| 2015 | 416 | 474 |
| 2016 | 434 | 373 |
| 2017 | 373 | 312 |
| 2018 | 309 | 268 |
| 2019 | 246 | 209 |
| 2020 | 207 | 201 |
| 2021 | 148 | 197 |
| 2022 | 157 | 212 |
| 2023 | 147 | 150 |
| 2024 | 156 | 161 |
| 2025 | 120 | 90 |
| 2026 | 71 | 56 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Semiconductor device29 Sep 2026US 12,751,333 B2Rohm Co., Ltd.
- Signal transmission device and insulated module29 Sep 2026US 12,751,339 B2Rohm Co., Ltd.
- Semiconductor package having a plurality of semiconductor chips stacked on a semiconductor substrate22 Sep 2026US 12,745,674 B2Samsung Electronics Co., Ltd.
- Semiconductor module15 Sep 2026US 12,740,453 B2Shindengen Electric Manufacturing Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor structure, fabrication method and package structure thereof17 Sep 2026US 2026/0283047 A1Vanguard International Semiconductor Corporation
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
Most cited
By later US patents
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Implantable microstimulator1,104US 5,193,539 AAlfred E. Mann Foundation for Scientific Research · 1993
- Mold tool for an optoelectronic element1,037US 6,830,711 B2Masimo Corporation · 2004
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999
- Active programmable electronic devices for molecular biological analysis and diagnostics1,006US 5,605,662 ANanogen, Inc. · 1997