H10W 72/5527
Eutectic alloys
Official title: {Eutectic alloys}
H10W72/5527 (Eutectic alloys) appears on 9 US grants and 10 published applications in this corpus.
Search patents in H10W- Granted patents
- 9
- Published applications
- 10
- Assignees
- 7
- Inventors
- 22
- Latest grant
- 13 Jun 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2017 | 1 | 1 |
| 2018 | 1 | 2 |
| 2019 | 2 | 2 |
| 2020 | 1 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 1 |
| 2023 | 2 | 1 |
| 2024 | 0 | 1 |
By publication year.
Recent patents
- Solder joints on nickel surface finishes without gold plating13 Jun 2023US 11,676,926 B2Schlumberger Technology Corporation
- Power semiconductor chip, method for producing a power semiconductor chip, and power semiconductor device30 May 2023US 11,664,335 B2Semikron Elektronik GmbH & Co. KG
- Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip19 Jul 2022US 11,393,967 B2Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip9 Feb 2021US 10,916,688 B2Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip7 Jul 2020US 10,707,395 B2Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Semiconductor device4 Apr 2024US 2024/0112988 A1Rohm Co., Ltd.
- Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip23 Mar 2023US 2023/0088776 A1Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Solder joints on nickel surface finishes without gold plating24 Feb 2022US 2022/0059489 A1Schlumberger Technology Corporation
- Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip29 Apr 2021US 2021/0126176 A1Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip1 Oct 2020US 2020/0313059 A1Xiamen Sanan Optoelectronics Technology Co., Ltd.
Most cited
By later US patents
- Semiconductor wire bonding machine cleaning device and method10US 9,825,000 B1International Test Solutions, Inc. · 2017
- Semiconductor wire bonding machine cleaning device and method8US 10,361,169 B2International Test Solutions, Inc. · 2019
- Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip3US 10,297,736 B2Xiamen Sanan Optoelectronics Technology Co., Ltd. · 2019
- Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip2US 10,707,395 B2Xiamen Sanan Optoelectronics Technology Co., Ltd. · 2020
- Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip1US 10,916,688 B2Xiamen Sanan Optoelectronics Technology Co., Ltd. · 2021