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US 9,825,000 B1Granted
Semiconductor wire bonding machine cleaning device and method
AssigneeInternational Test Solutions, Inc.
InventorsAlan E. Humphrey, Wayne C. Smith, Janakraj Shivlal, Bret A. Humphrey
Life of this patent
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Abstract
A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
Claims30
A method for cleaning a wire bonding machine, comprising:
- positioning a capillary tube that is connected to a wire bonding machine near an elastomeric cleaning material;
- and
- inserting, while the capillary tube remains attached to the wire bonding machine, the capillary tube into the elastomeric cleaning material so that an end of the capillary tube penetrates the elastomeric cleaning material that removes debris from the capillary tube.
A method for operating a wire bonding machine, comprising:
- performing a plurality of wire bonding operations using a capillary tube and a wire that passes through the capillary tube;
- and
- periodically inserting, while the capillary tube remains attached to the wire bonding machine, the capillary tube into an elastomeric cleaning material so that an end of the capillary tube penetrates the elastomeric cleaning material that removes debris from the capillary tube.
A wire bonding apparatus, comprising:
- a wire bonding machine having a capillary tube through which a wire is threaded for creating wire bonds for semiconductor devices;
- and
- an elastomeric cleaning material associated with the wire bonding machine into which an end of the capillary tube penetrates while still attached to the wire bonding machine to refurbish the capillary tube and remove debris from in and around the capillary tube.
Dependencies are inferred from the claim text.