Semiconductor device
AssigneeRohm Co., Ltd.
InventorsKaori UEBAYASHI, Maki MITA
Life of this patent
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Abstract
A semiconductor device includes a semiconductor element, a first lead electrically connected to the semiconductor element, and a connecting member connected to the semiconductor element and the first lead. The connecting member includes a core containing a first material, and a surface layer. The surface layer contains a first metal and covers the core. The first material includes an alloy in which at least a third metal is added to a second metal and has a higher corrosion resistance than the second metal. The third metal has the highest proportion among the metals added and has an atomic number greater than the second metal.
Claims14
A semiconductor device comprising:
- a semiconductor element;
- a first lead electrically connected to the semiconductor element;
- and
- a connecting member connected to the semiconductor element and the first lead, wherein
- the connecting member includes a core containing a first material and a surface layer, the surface layer covering the core and containing a first metal,
- the first material includes an alloy in which at least a third metal is added to a second metal and has a higher corrosion resistance than the second metal, and
- the third metal has a highest proportion among the metals added and has an atomic number greater than the second metal.
Dependencies are inferred from the claim text.