H10W 72/5524
Comprising aluminium [al]
Official title: {comprising aluminium [Al]}
H10W72/5524 (Comprising aluminium [al]) appears on 5,678 US grants and 5,085 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,678
- Published applications
- 5,085
- Assignees
- 1,066
- Inventors
- 8,303
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 11 | 0 |
| 1978 | 6 | 0 |
| 1979 | 7 | 0 |
| 1980 | 9 | 0 |
| 1981 | 4 | 0 |
| 1982 | 10 | 0 |
| 1983 | 11 | 0 |
| 1984 | 13 | 0 |
| 1985 | 23 | 0 |
| 1986 | 28 | 0 |
| 1987 | 26 | 0 |
| 1988 | 26 | 0 |
| 1989 | 39 | 0 |
| 1990 | 45 | 0 |
| 1991 | 64 | 0 |
| 1992 | 65 | 0 |
| 1993 | 54 | 0 |
| 1994 | 78 | 0 |
| 1995 | 59 | 0 |
| 1996 | 83 | 0 |
| 1997 | 88 | 0 |
| 1998 | 122 | 0 |
| 1999 | 133 | 0 |
| 2000 | 144 | 0 |
| 2001 | 185 | 108 |
| 2002 | 197 | 241 |
| 2003 | 208 | 209 |
| 2004 | 203 | 206 |
| 2005 | 180 | 276 |
| 2006 | 193 | 233 |
| 2007 | 176 | 253 |
| 2008 | 139 | 259 |
| 2009 | 159 | 239 |
| 2010 | 224 | 267 |
| 2011 | 241 | 237 |
| 2012 | 220 | 244 |
| 2013 | 217 | 236 |
| 2014 | 228 | 220 |
| 2015 | 220 | 233 |
| 2016 | 222 | 187 |
| 2017 | 186 | 156 |
| 2018 | 160 | 166 |
| 2019 | 141 | 146 |
| 2020 | 134 | 155 |
| 2021 | 111 | 163 |
| 2022 | 130 | 200 |
| 2023 | 116 | 149 |
| 2024 | 151 | 152 |
| 2025 | 114 | 91 |
| 2026 | 63 | 59 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor module6 Oct 2026US 12,757,768 B2Shindengen Electric Manufacturing Co., Ltd.
- Semiconductor device29 Sep 2026US 12,751,333 B2Rohm Co., Ltd.
- Signal transmission device and insulated module29 Sep 2026US 12,751,339 B2Rohm Co., Ltd.
- Semiconductor module15 Sep 2026US 12,740,453 B2Shindengen Electric Manufacturing Co., Ltd.
- Aluminum bonding wire coated by photo-curing polymer, preparation method, and application therefor8 Sep 2026US 12,729,454 B2China Academy of Machinery Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor device24 Sep 2026US 2026/0293686 A1Rohm Co., Ltd.
- Semiconductor device3 Sep 2026US 2026/0262537 A1Rohm Co., Ltd.
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
Most cited
By later US patents
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999
- Active programmable electronic devices for molecular biological analysis and diagnostics1,006US 5,605,662 ANanogen, Inc. · 1997
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998