H10W 72/59
Bond pads specially adapted therefor
H10W72/59 (Bond pads specially adapted therefor) appears on 9,174 US grants and 9,371 published applications in this corpus.
Search patents in H10W- Granted patents
- 9,174
- Published applications
- 9,371
- Assignees
- 1,360
- Inventors
- 13,311
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 15 | 0 |
| 1978 | 7 | 0 |
| 1979 | 8 | 0 |
| 1980 | 8 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 8 | 0 |
| 1984 | 10 | 0 |
| 1985 | 10 | 0 |
| 1986 | 16 | 0 |
| 1987 | 12 | 0 |
| 1988 | 21 | 0 |
| 1989 | 27 | 0 |
| 1990 | 33 | 0 |
| 1991 | 45 | 0 |
| 1992 | 50 | 0 |
| 1993 | 48 | 0 |
| 1994 | 69 | 0 |
| 1995 | 65 | 0 |
| 1996 | 63 | 0 |
| 1997 | 68 | 0 |
| 1998 | 109 | 0 |
| 1999 | 128 | 0 |
| 2000 | 165 | 0 |
| 2001 | 200 | 126 |
| 2002 | 226 | 279 |
| 2003 | 221 | 287 |
| 2004 | 232 | 237 |
| 2005 | 213 | 334 |
| 2006 | 209 | 326 |
| 2007 | 216 | 313 |
| 2008 | 217 | 402 |
| 2009 | 194 | 298 |
| 2010 | 301 | 420 |
| 2011 | 324 | 395 |
| 2012 | 346 | 428 |
| 2013 | 392 | 399 |
| 2014 | 413 | 460 |
| 2015 | 448 | 551 |
| 2016 | 506 | 477 |
| 2017 | 483 | 482 |
| 2018 | 416 | 428 |
| 2019 | 429 | 468 |
| 2020 | 401 | 524 |
| 2021 | 380 | 480 |
| 2022 | 405 | 462 |
| 2023 | 345 | 298 |
| 2024 | 334 | 234 |
| 2025 | 221 | 168 |
| 2026 | 103 | 95 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Stacked semiconductor die assemblies with support members and associated systems and methods1 Sep 2026US 12,727,515 B2Micron Technology, Inc.
- Semiconductor device and method of manufacturing semiconductor device25 Aug 2026US 12,720,799 B2Fuji Electric Co., Ltd.
- Semiconductor device having a plurality of circuit patterns on a resin insulating layer25 Aug 2026US 12,721,164 B2Mitsubishi Electric Corporation
- Semiconductor package including antenna substrate and manufacturing method thereof1 Oct 2026US 2026/0302594 A1Advanced Semiconductor Engineering, Inc.
- Multi-layer metal stack for wire bonding1 Oct 2026US 2026/0305453 A1
- High bandwidth 3d mesh interconnect structure1 Oct 2026US 2026/0305499 A1Atum Works Inc.
- Semiconductor device24 Sep 2026US 2026/0293686 A1Rohm Co., Ltd.
- Substrate assembly with surface structure17 Sep 2026US 2026/0282995 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Multi-chip semiconductor arrangements using flip chip dies446US 5,399,898 ALSI Logic Corporation · 1995
- Semiconductor radiation emitter package423US 6,335,548 B12002