Substrate assembly with surface structure

Abstract

A substrate arrangement and a method for producing an electronic assembly. The substrate arrangement has (a) a bonding substrate which comprises an upper side and an underside, and (b) a contacting layer which comprises a contacting means, wherein the contacting layer is connected to the underside of the bonding substrate in a planar manner at least in regions, wherein the underside of the bonding substrate (i) has an arithmetic mean roughness value R(1)a along at least one section S1, and (ii) an arithmetic mean roughness value R(2)a along at least one section S2, wherein the at least one section S2 runs perpendicularly to the at least one section S1, wherein the ratio Q of arithmetic mean roughness value R(1)a to arithmetic mean roughness value R(2)a is in the range of 1.70-10.00.

Dependencies are inferred from the claim text.