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US 12,727,515 B2Granted
Stacked semiconductor die assemblies with support members and associated systems and methods
AssigneeMicron Technology, Inc.
InventorsHong Wan Ng, Seng Kim Ye
Life of this patent
Estimating the term…
Abstract
Stacked semiconductor die assemblies with support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a plurality of support members also attached to the package substrate. The plurality of support members can include a first support member and a second support member disposed at opposite sides of the first semiconductor die, and a second semiconductor die can be coupled to the support members such that at least a portion of the second semiconductor die is over the first semiconductor die.
Claims20
A semiconductor die assembly, comprising:
- a package substrate including a plurality of first bond pads positioned within a longitudinal footprint of the package substrate and a plurality of second bond pads positioned peripheral to the longitudinal footprint, wherein the plurality of first bond pads include a first subset of two or more first bond pads extending in a first direction and a second subset of two or more first bond pads extending in a second direction orthogonal to the first direction;
- a first semiconductor die carried by the package substrate and coupled to each of the plurality of the first bond pads of the package substrate and positioned within the longitudinal footprint;
- a plurality of support members carried by the package substrate, the plurality of support members including a first support member and a second support member disposed on opposite sides of the first semiconductor die and peripheral to the longitudinal footprint;
- a second semiconductor die carried by the plurality of support members such that at least a portion of the second semiconductor die is over the first semiconductor die;
- a first die-attach film attaching each of the support members to the second semiconductor die, but not attaching the first semiconductor die to the second semiconductor die,
- wherein the first die-attach film extends between the second semiconductor die and the first semiconductor die and between the second semiconductor die and each of the support members, and wherein the first die-attach film has a uniform thickness;
- a second die-attach film attaching one of the support members to the package substrate;
- and
- a resin-filled cavity between the first semiconductor die, the plurality of support members, and the first die-attach film.
6 more elements
A semiconductor die assembly, comprising:
- a package substrate including a plurality of first bond pads arranged in a two-dimensional array;
- a first semiconductor die coupled to each of the plurality of the first bond pads of the package substrate, wherein the first semiconductor die and the plurality of first bond pads are positioned within a first region of the package substrate;
- a plurality of support members attached to the package substrate in a second region peripheral to the first region, the plurality of support members including a first support member and a second support member disposed peripheral to opposite sides of the first semiconductor die;
- a second semiconductor die coupled to the plurality of support members such that at least a portion of the second semiconductor die is disposed over the first semiconductor die;
- a mold resin disposed at least partially around the first semiconductor die between the plurality of support members;
- a first die-attach film between the second semiconductor die and a surface comprising the plurality of support members and the mold resin, and a second die-attach film attaching one of the support members to the package substrate.
3 more elements
A stacked semiconductor device, comprising:
- a package substrate having a first region and a second region circumferentially surrounding the first region, the package substrate comprising:
- a plurality of first bond pads positioned within the first region, the plurality of first bond pads including a first subset extending in a first direction and a second subset extending in a second direction perpendicular to the first direction;
- and
- a plurality of second bond pads positioned in the second region;
- a first semiconductor die carried by the first region of the package substrate and electrically coupled to each of the plurality of first bond pads;
- a plurality of support members carried by the second region of the package substrate, the plurality of support members including a first support member positioned peripheral to a first side of the first region and a second support member positioned peripheral to a second side of the first region opposite the first side, wherein the plurality of support members define a cavity around the first semiconductor die, and wherein the cavity is at least partially filled with resin;
- and
- a second semiconductor die carried by the plurality of support members such that at least a portion of the second semiconductor die extends over the first semiconductor die, wherein the second semiconductor die is electrically coupled to one or more of the second bond pads by wirebonds.
5 more elements
Dependencies are inferred from the claim text.