Method and apparatus for 3D interconnect
AssigneeASM America, Inc.
InventorCyprian Emeka Uzoh
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Abstract
The present invention discloses methods for depositing a material, particularly a conductive material, in cavities of a substrate and forming bonding contacts or pads thereon. An intracavity structure may be utilized in conjunction with embodiments of the present invention to provide efficient filling of diverse cavities within the substrate. Also provided are embodiments for interconnection structures using filled cavities, along with electrically conductive or reactive structures which may include capacitors fabricated within a substrate.
Claims42
A method for filling a cavity defined within a substrate, the cavity having sidewalls, the steps comprising:
- placing an intracavity structure within the cavity, the intracavity structure partitioning the cavity into a plurality of subcavities, wherein placing the intracavity structure within the cavity includes:
- forming the intracavity structure outside of the cavity;
- and
- inserting the formed intracavity structure into the cavity;
- and
- substantially filling the subcavities with a conductive deposition material.
A method for filling a cavity defined within a substrate, the cavity having a bottom and sidewalls, the steps comprising:
- partitioning the cavity into a plurality of subcavities, each of the subcavities having a respective predetermined subcavity volume;
- depositing an initial conductive layer within at least one of the subcavity volumes, wherein the initial conductive layer is for electrical communication with a conductive element in the substrate;
- and
- depositing a conductive material within the plurality of subcavities, wherein the conductive material substantially fills at least one of the subcavity volumes to a predetermined amount.
A method for filling a cavity defined within a substrate, the cavity having a bottom and sidewalls, the steps comprising:
- placing a pre-formed structure within the cavity, the pre-formed structure partitioning the cavity into a plurality of subcavities, wherein the pre-formed structure:
- comprises a conductive material;
- has a predetermined vertical dimension less than a height dimension of the sidewalls;
- and
- has a predetermined footprint area less than or equal to an area of the bottom of the cavity;
- depositing a metal layer within at least one of the subcavity volumes, wherein the metal layer is for electrical communication with a conductive element in the substrate;
- and
- substantially filling the subcavities with a conductive deposition material.
A method for filling a cavity defined within a substrate, the cavity having sidewalls, the steps comprising:
- placing a pre-formed structure within the cavity, the pre-formed structure partitioning the cavity into a plurality of subcavities;
- depositing a metal layer within at least one of the subcavity volumes, wherein the metal layer is for electrical communication with a conductive element in the substrate;
- and
- substantially filling the subcavities with a conductive deposition material.
Dependencies are inferred from the claim text.