H10W 72/812
Interconnections on sidewalls of encapsulations
Official title: {Interconnections on sidewalls of encapsulations, e.g. conductive traces on molded resins}
H10W72/812 (Interconnections on sidewalls of encapsulations) appears on 0 US grants and 4 published applications in this corpus.
Search patents in H10W- Granted patents
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- Published applications
- 4
- Assignees
- 3
- Inventors
- 15
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| Year | Granted patents | Published applications |
|---|---|---|
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 0 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Electronic device13 Aug 2026US 2026/0240008 A1Innolux Corporation
- Semiconductor chip including top pad and side pad and semiconductor package including the same25 Jun 2026US 2026/0182432 A1Samsung Electronics Co., Ltd.
- Semiconductor package16 Apr 2026US 2026/0107835 A1Samsung Electronics Co., Ltd.
- Method for manufacturing semiconductor apparatus and semiconductor apparatus4 Apr 2024US 2024/0112990 A1Rohm Co., Ltd.
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