H10W 72/851
Dispositions of multiple connectors or interconnections
Official title: {Dispositions of multiple connectors or interconnections}
H10W72/851 (Dispositions of multiple connectors or interconnections) appears on 35,662 US grants and 39,222 published applications in this corpus.
Search patents in H10W- Granted patents
- 35,662
- Published applications
- 39,222
- Assignees
- 3,437
- Inventors
- 37,571
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 13 | 0 |
| 1978 | 13 | 0 |
| 1979 | 6 | 0 |
| 1980 | 7 | 0 |
| 1981 | 10 | 0 |
| 1982 | 16 | 0 |
| 1983 | 16 | 0 |
| 1984 | 19 | 0 |
| 1985 | 33 | 0 |
| 1986 | 28 | 0 |
| 1987 | 39 | 0 |
| 1988 | 48 | 0 |
| 1989 | 69 | 0 |
| 1990 | 83 | 0 |
| 1991 | 109 | 0 |
| 1992 | 135 | 0 |
| 1993 | 145 | 0 |
| 1994 | 201 | 0 |
| 1995 | 205 | 0 |
| 1996 | 219 | 0 |
| 1997 | 231 | 0 |
| 1998 | 408 | 0 |
| 1999 | 491 | 0 |
| 2000 | 546 | 0 |
| 2001 | 736 | 340 |
| 2002 | 784 | 1033 |
| 2003 | 873 | 1067 |
| 2004 | 934 | 1247 |
| 2005 | 887 | 1510 |
| 2006 | 955 | 1441 |
| 2007 | 961 | 1662 |
| 2008 | 891 | 1716 |
| 2009 | 974 | 1648 |
| 2010 | 1371 | 1595 |
| 2011 | 1483 | 1618 |
| 2012 | 1379 | 1718 |
| 2013 | 1506 | 1684 |
| 2014 | 1578 | 1771 |
| 2015 | 1743 | 1932 |
| 2016 | 1785 | 1685 |
| 2017 | 1715 | 1658 |
| 2018 | 1501 | 1513 |
| 2019 | 1557 | 1698 |
| 2020 | 1535 | 2018 |
| 2021 | 1458 | 1867 |
| 2022 | 1440 | 1847 |
| 2023 | 1426 | 1401 |
| 2024 | 1299 | 1679 |
| 2025 | 1111 | 1201 |
| 2026 | 681 | 673 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Semiconductor device6 Oct 2026US 12,757,766 B2Rohm Co., Ltd.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
Most cited
By later US patents
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- H-bridge drive utilizing a pair of high and low side MOSFETs in a common insulation housing1,067US 6,747,300 B2Ternational Rectifier Corporation · 2004
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999