H10W 72/853
On the same surface
Official title: {On the same surface}
H10W72/853 (On the same surface) appears on 8,009 US grants and 8,354 published applications in this corpus.
Search patents in H10W- Granted patents
- 8,009
- Published applications
- 8,354
- Assignees
- 1,040
- Inventors
- 10,451
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 15 | 0 |
| 1992 | 23 | 0 |
| 1993 | 37 | 0 |
| 1994 | 43 | 0 |
| 1995 | 55 | 0 |
| 1996 | 66 | 0 |
| 1997 | 66 | 0 |
| 1998 | 130 | 0 |
| 1999 | 184 | 0 |
| 2000 | 211 | 0 |
| 2001 | 318 | 163 |
| 2002 | 327 | 410 |
| 2003 | 338 | 337 |
| 2004 | 313 | 368 |
| 2005 | 277 | 400 |
| 2006 | 272 | 372 |
| 2007 | 239 | 448 |
| 2008 | 212 | 395 |
| 2009 | 252 | 355 |
| 2010 | 325 | 321 |
| 2011 | 310 | 321 |
| 2012 | 266 | 312 |
| 2013 | 316 | 270 |
| 2014 | 297 | 285 |
| 2015 | 281 | 291 |
| 2016 | 289 | 263 |
| 2017 | 256 | 241 |
| 2018 | 224 | 265 |
| 2019 | 287 | 341 |
| 2020 | 271 | 394 |
| 2021 | 282 | 375 |
| 2022 | 297 | 380 |
| 2023 | 264 | 291 |
| 2024 | 264 | 344 |
| 2025 | 246 | 255 |
| 2026 | 135 | 157 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/856Bump connectors and die-attach connectors3,017
- H10W 72/865Die-attach connectors and bond wires2,663
- H10W 72/871Bond wires and strap connectors1,042
- H10W 72/859Bump connectors and bond wires842
- H10W 72/868Die-attach connectors and strap connectors58
- H10W 72/862Bump connectors and strap connectors18
Recent patents
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- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Three-dimensional device package with carrier substrate and thermal vias29 Sep 2026US 12,751,288 B1Marvel Asia Pte Ltd
- Semiconductor package and method of manufacturing the semiconductor package29 Sep 2026US 12,751,315 B2Samsung Electronics Co., Ltd.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package with an embedded interconnect and a method of making the same8 Oct 2026US 2026/0314436 A1Texas Instruments Incorporated
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Power electronics module and inverter including a power electronics module8 Oct 2026US 2026/0314465 A1Schaeffler Technologies AG & Co. KG
Most cited
By later US patents
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989
- Single piece package for semiconductor die528US 5,739,585 AMicron Technology, Inc. · 1998
- Surface acoustic wave device mounted module473US 5,459,368 AMatsushita Electric Industrial Co., Ltd. · 1995
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Multi-chip semiconductor arrangements using flip chip dies446US 5,399,898 ALSI Logic Corporation · 1995