H10W 72/865
Die-attach connectors and bond wires
Official title: {Die-attach connectors and bond wires}
H10W72/865 (Die-attach connectors and bond wires) appears on 2,663 US grants and 2,584 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,663
- Published applications
- 2,584
- Assignees
- 430
- Inventors
- 3,705
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 8 | 0 |
| 1993 | 24 | 0 |
| 1994 | 25 | 0 |
| 1995 | 27 | 0 |
| 1996 | 34 | 0 |
| 1997 | 29 | 0 |
| 1998 | 55 | 0 |
| 1999 | 77 | 0 |
| 2000 | 96 | 0 |
| 2001 | 137 | 77 |
| 2002 | 156 | 177 |
| 2003 | 132 | 135 |
| 2004 | 130 | 133 |
| 2005 | 106 | 136 |
| 2006 | 102 | 124 |
| 2007 | 91 | 139 |
| 2008 | 66 | 122 |
| 2009 | 84 | 117 |
| 2010 | 102 | 87 |
| 2011 | 90 | 66 |
| 2012 | 68 | 87 |
| 2013 | 87 | 93 |
| 2014 | 84 | 76 |
| 2015 | 89 | 90 |
| 2016 | 88 | 71 |
| 2017 | 54 | 71 |
| 2018 | 64 | 86 |
| 2019 | 87 | 92 |
| 2020 | 72 | 118 |
| 2021 | 73 | 88 |
| 2022 | 86 | 85 |
| 2023 | 58 | 92 |
| 2024 | 55 | 97 |
| 2025 | 61 | 70 |
| 2026 | 56 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989
- Single piece package for semiconductor die528US 5,739,585 AMicron Technology, Inc. · 1998
- Thin, stackable semiconductor packages437US 6,303,997 B1Amkor Technology, Inc. · 2001
- Method of producing a single piece package for semiconductor die427US 5,674,785 AMicron Technology, Inc. · 1997
- Stackable ball grid array package387US 6,072,233 AMicron Technology, Inc. · 2000