Power module
AssigneesHyundai Motor Company, Kia Corporation
InventorsSung Taek HWANG, Se Yoon Jeong, Sung Won Park, Nam Sik Kong
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Abstract
A power module includes a substrate including an insulating layer, a first metal layer disposed on a first surface of the insulating layer, and a second metal layer disposed on a second surface of the insulating layer, and a cooling unit connected to one surface of the substrate on which the second metal layer is disposed. An external surface of the second metal layer includes at least one first cooling groove, and the cooling unit includes at least one second cooling groove forming a cooling flow path, together with the first cooling groove.
Claims20
A power module comprising:
- a substrate including an insulating layer, a first metal layer disposed on a first surface of the insulating layer, and a second metal layer disposed on a second surface of the insulating layer;
- and
- a cooling unit connected to one surface of the substrate on which the second metal layer is disposed;
- wherein an external surface of the second metal layer includes at least one first cooling groove, and the cooling unit includes at least one second cooling groove forming a cooling flow path, together with the first cooling groove.
A power module comprising:
- a substrate including an insulating layer, a first metal layer disposed on a first surface of the insulating layer, and a second metal layer disposed on a second surface of the insulating layer;
- and
- a cooling unit connected to one surface of the substrate on which the second metal layer is disposed, the cooling unit having a cooling flow path;
- wherein a plurality of first cooling protrusions are disposed on an external surface of the second metal layer, and at least a portion of the first cooling protrusions is disposed in the cooling flow path, and
- wherein a second cooling protrusion, protruding to a space between the first cooling protrusions disposed to be adjacent to each other, is disposed on a bottom surface of the cooling unit.
Dependencies are inferred from the claim text.