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H10W 72/859

Bump connectors and bond wires

Official title: {Bump connectors and bond wires}

H10W72/859 (Bump connectors and bond wires) appears on 842 US grants and 975 published applications in this corpus.

Search patents in H10W

Granted patents: 842
Published applications: 975
Assignees: 248
Inventors: 1,528
Latest grant: 6 Oct 2026

Filings by year

H10W 72/859: granted patents and published applications per publication year
Year	Granted patents	Published applications
1992	1	0
1993	0	0
1994	2	0
1995	2	0
1996	3	0
1997	2	0
1998	4	0
1999	6	0
2000	14	0
2001	7	4
2002	5	17
2003	22	21
2004	20	43
2005	24	39
2006	25	31
2007	25	44
2008	17	44
2009	16	36
2010	45	48
2011	40	57
2012	39	50
2013	40	50
2014	58	53
2015	59	52
2016	46	33
2017	46	42
2018	34	41
2019	42	47
2020	39	46
2021	32	46
2022	38	27
2023	33	31
2024	22	30
2025	26	28
2026	8	15

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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Most cited

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