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US 5,977,640 AGranted
Highly integrated chip-on-chip packaging
AssigneeInternational Business Machines Corporation
InventorsClaude Louis Bertin, Thomas George Ference, Wayne John Howell, Edmund Juris Sprogis
Life of this patent
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Abstract
The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry.
Claims13
An apparatus comprising:
- a chip-on-chip module having at least two independent chips with active regions electrically connected together, wherein said active regions of said two chips are facing each other;
- and
- an interconnection substrate for electrically connecting said chips to external circuitry, the interconnection substrate including a first set of connection elements connected to the active regions of the chips, a second set of connection elements for connection to the external circuitry, and a substrate having conductive lines, the conductive lines connecting the first set of connection elements to the second set of connection elements;
- wherein the second set of connection elements includes a first set of connectors, planar with a first backside of one of the at least two chins, and a second set of connectors, planar with a second backside of another of the at least two chips, for connecting the chip-on-chip module to a second chip-on-chip module.
1 more element
A chip-on-chip package comprising:
- an external component;
- a chip-on-chip module having at least two independent chips with active regions electrically connected together, wherein said active regions of said two chips are facing each other;
- and
- an interconnection substrate for electrically connecting said chips and said external component, the interconnection substrate including a first set of connection elements connected to the active regions of the chips, a second set of connection elements for connection to the external component, and a substrate having conductive lines, the conductive lines connecting the first set of connection elements to the second set of connection elements;
- wherein the second set of connection elements includes a first set of connectors, planar with a first backside of one of the at least two chips, and a second set of connectors, planar with a second backside of another of the at least two chips, for connecting the chip-on-chip module to a second chip-on-chip module.
2 more elements
Dependencies are inferred from the claim text.