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US 12,740,390 B2Granted
Stacked integrated circuit devices with face-to-face connections between logic and memory dies
AssigneeQUALCOMM Incorporated
InventorsYangyang Sun, Yue Li, Lily Zhao
Life of this patent
Estimating the term…
Abstract
A stacked IC device includes a first memory die and a second memory die coupled to the substrate. The stacked IC device also includes a logic die electrically connected, face-to-face, to the first memory die and the second memory die and electrically connected to the substrate by conductors that extend through a region between the first memory die and the second memory die.
Claims18
A stacked integrated circuit (IC) device comprising:
- a first memory die coupled to a substrate;
- a second memory die coupled to the substrate;
- a logic die electrically connected, face-to-face, to the first memory die and the second memory die and electrically connected to the substrate by conductors that extend through a region between the first memory die and the second memory die;
- and
- wire bonds electrically connecting contacts on a face of the first memory die to contacts of the substrate.
2 more elements
A stacked IC device comprising:
- a first memory die coupled to a substrate;
- a second memory die coupled to the substrate;
- a first logic die electrically connected, face-to-face, to the first memory die;
- a second logic die electrically connected, face-to-face, to the second memory die;
- conductors extending through a region between the first memory die and the second memory die and electrically connecting the first logic die and the second logic die to the substrate;
- and
- wherein the first memory die is coupled to a recess in the substrate.
4 more elements
A method comprising:
- attaching a first memory die to a substrate;
- attaching a second memory die to the substrate;
- electrically connecting a logic die to the substrate, to the first memory die, and to the second memory die such that the logic die is oriented face-to-face with the first memory die and the second memory die and conductors that electrically connect the logic die to the substrate extend through a region between the first memory die and the second memory die;
- and
- electrically connecting contacts on a face of the first memory die to contacts of the substrate with wire bonds.
2 more elements
Dependencies are inferred from the claim text.