Package structure and method for manufacturing the same

Abstract

A method for manufacturing a package structure includes the following steps. A semiconductor die is formed, the semiconductor die including a plurality of conductive pads disposed on a first surface of the semiconductor die. An electrical test is performed on the semiconductor die by the conductive pads. A phase change material layer is formed on the first surface of the semiconductor die, and the phase change material layer is electrically connected to the conductive pads. A packaging process is performed to form a conductive feature on the conductive pads of the semiconductor die. One end of the conductive feature penetrates the phase change material layer. An annealing process is performed to change the crystal of the phase change material layer from a crystalline state to an amorphous state.

Dependencies are inferred from the claim text.