Packaged microelectronic die assemblies and methods of manufacture
AssigneeMicron Technology, Inc.
InventorOw Chee Moon
Life of this patent
Estimating the term…
Abstract
Packaged microelectronic devices, interface substrates for packaging microelectronic devices, and methods of packaging single-die or stacked-die devices. One embodiment can include a die, an interface member having a die section attached to the die and an array section, and a casing encapsulating at least a portion of the die. The die section has a plurality of contacts coupled to bond-pads on the die, and the array section has an array of ball-pads coupled to the contacts by interconnecting circuitry in the interface member. The array section is folded over and/or under the die section, and the array section is attached to a backside of the die and/or a surface of the casing.
Claims4
A microelectronic device, comprising:
- a first microelectronic die including an interior surface, an integrated circuit, and a plurality of first bond-pads arranged in a first terminal array at the interior surface, wherein the bond-pads are coupled to the integrated circuit;
- and
- a first interface substrate comprising a first section attached to the interior surface of the first die, an intermediate section extending at an angle from the first section, a second section extending from the intermediate section and being spaced across from the first section, a plurality of first contacts arranged in a first contact array on the first section and electrically coupled to the bond-pads of the first die, a plurality of ball-pads on the second section arranged in an exposed ball-pad array, and interconnecting circuitry electrically coupling at least a portion of the ball-pads with corresponding first contacts.
A microelectronic device comprising:
- a first microelectronic die including an interior surface, an integrated circuit, and a plurality of first bond-pads arranged in a first terminal array at the interior surface, wherein the bond-pads are coupled to the integrated circuit, and wherein the first die includes an active side defined by the interior surface of the first die upon which the first bond-pads are arranged and a backside opposite the active side;
- and
- a first interface substrate comprising a first section adhered to the active side of the first die, an intermediate section extending at an angle from the first section, a second section extending from the intermediate section and being spaced across from the first section, a plurality of first contacts arranged in a first contact array on the first section and electrically coupled to the bond-pads of the first die, a plurality of ball-pads on the second section arranged in an exposed ball-pad array, the second section having a first array section and a second array section that are adhered to the backside of the first die.
Dependencies are inferred from the claim text.