Package structure, apparatus, and method for preparing the same
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsPing MO, Li TAO, Peng CHEN, Hongqing PAN
Life of this patent
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Abstract
Implementations provide package structures, apparatuses, and methods for preparing the same. In an implementation, a package structure comprises: a mounting substrate; a first die disposed above the mounting substrate, the first die comprising a first main surface, a second main surface opposite to the first main surface, and an active device formed adjacent to the first main surface; and a second die interposed between the first die and the mounting substrate, wherein the first main surface of the first die faces towards the second die.
Claims20
A package structure comprising:
- a mounting substrate;
- a first die disposed above the mounting substrate, the first die comprising a first main surface, a second main surface opposite to the first main surface and an active device formed adjacent to the first main surface;
- and
- a second die interposed between the first die and the mounting substrate,
- wherein the first main surface of the first die faces towards the second die.
An apparatus comprising:
- a board;
- and
- a package structure mounted over the board, the package structure comprising:
- a mounting substrate;
- a first die disposed above the mounting substrate, the first die comprising a first main surface, a second main surface opposite to the first main surface and an active device formed adjacent to the first main surface;
- and
- a second die interposed between the first die and the mounting substrate,
- wherein the first main surface of the first die faces towards the second die.
A method for preparing a package structure, comprising:
- providing a mounting substrate;
- and
- mounting a plurality of dies at least comprising a first die and a second die over the mounting substrate with the second die interposed between the first die and the mounting substrate, the first die comprising a first main surface, a second main surface opposite to the first main surface and an active device formed adjacent to the first main surface,
- wherein the first die is mounted over the second die with the first main surface of the first die facing towards the second die.
Dependencies are inferred from the claim text.