H10W 72/871
Bond wires and strap connectors
Official title: {Bond wires and strap connectors}
H10W72/871 (Bond wires and strap connectors) appears on 1,042 US grants and 1,326 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,042
- Published applications
- 1,326
- Assignees
- 194
- Inventors
- 1,536
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 4 |
| 2002 | 6 | 10 |
| 2003 | 10 | 9 |
| 2004 | 10 | 10 |
| 2005 | 8 | 15 |
| 2006 | 11 | 28 |
| 2007 | 12 | 49 |
| 2008 | 17 | 30 |
| 2009 | 22 | 45 |
| 2010 | 34 | 39 |
| 2011 | 43 | 58 |
| 2012 | 41 | 69 |
| 2013 | 63 | 57 |
| 2014 | 50 | 76 |
| 2015 | 73 | 70 |
| 2016 | 66 | 69 |
| 2017 | 59 | 56 |
| 2018 | 58 | 72 |
| 2019 | 57 | 54 |
| 2020 | 54 | 63 |
| 2021 | 57 | 91 |
| 2022 | 60 | 104 |
| 2023 | 51 | 72 |
| 2024 | 72 | 83 |
| 2025 | 69 | 58 |
| 2026 | 26 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chip package with contact clip8 Sep 2026US 12,730,135 B2Infineon Technologies AG
- Method for manufacturing semiconductor apparatus and semiconductor apparatus8 Sep 2026US 12,733,511 B2Rohm Co., Ltd.
- Power semiconductor device25 Aug 2026US 12,721,245 B2Infineon Technologies Austria AG
- Electrical circuit body, power converter, and electrical circuit body manufacturing method4 Aug 2026US 12,702,049 B2Hitachi Astemo, Ltd.
- Semiconductor device4 Aug 2026US 12,702,054 B2Fuji Electric Co., Ltd.
- Power electronics module and inverter including a power electronics module8 Oct 2026US 2026/0314465 A1Schaeffler Technologies AG & Co. KG
- Thermally conductive structure for heat dissipation at an integrated circuit die27 Aug 2026US 2026/0255956 A1STMicroelectronics International N. V.
- Semiconductor device13 Aug 2026US 2026/0240037 A1Fuji Electric Co., Ltd.
- Semiconductor device30 Jul 2026US 2026/0223748 A1Kabushiki Kaisha Toshiba
- Power semiconductor module30 Jul 2026US 2026/0223757 A1Dynex Semiconductor Limited
Most cited
By later US patents
- Leadless semiconductor device and method for making the same346US 5,172,214 AMotorola, Inc. · 1992
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Method for coupling a power lead to a bond pad in an electronic module235US 5,544,412 AMotorola, Inc. · 1996
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Ball grid array semiconductor package and substrate without power ring or ground ring191US 6,667,546 B2Siliconware Precision Industries Co., Ltd. · 2003