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AssigneeHitachi Astemo, Ltd.
InventorsNing Tang, Nobutake Tsuyuno, Yujiro Kaneko, Eiichi Ide
Estimating the term…
An electrical circuit body includes a power semiconductor element joined to one face of a conductor plate, a sheet member including an insulating layer joined to the other face of the conductor plate, a sealing member integrally sealing the sheet member, the conductor plate, and the power semiconductor element in a state where a face, of the sheet member, opposite to a face joined to the conductor plate is exposed, and a cooling member bonded to the opposite face of the sheet member via a heat conduction member, wherein the sealing member has a recess along an outer edge of the sheet member on a surface where the sheet member is exposed, the recess being located outside the sheet member.
An electrical circuit body comprising:
A method for manufacturing an electrical circuit body, the electrical circuit body including a power semiconductor element joined to one face of a conductor plate, a sheet member including an insulating layer joined to another face of the conductor plate, a sealing member integrally sealing the sheet member, the conductor plate, and the power semiconductor element in a state where a face, of the sheet member, opposite to a face joined to the conductor plate is exposed, and a cooling member bonded to the opposite face of the sheet member via a heat conduction member, the method comprising:
Dependencies are inferred from the claim text.