Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsSusumu OBATA, Kazuhito HIGUCHI, Tatsuya OHGURO, Takenori YASUZUMI, Hiroki KAWAKAMI
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsSusumu OBATA, Kazuhito HIGUCHI, Tatsuya OHGURO, Takenori YASUZUMI, Hiroki KAWAKAMI
Estimating the term…
According to one embodiment, a semiconductor device includes: a package substrate including first and second terminals; a first chip on the first terminal and including a switch; a connector extending from a front surface of the first chip to the second terminal; and a second chip on the connector above the first chip and including a resistor and a capacitor in a semiconductor substrate. The first chip includes a first electrode on the front surface of the first chip and a second electrode on a back surface of the first chip. The second chip includes a third electrode and a fourth electrode. The first electrode is coupled to the second terminal, the second electrode is coupled to the first terminal, the third electrode is coupled to the first terminal, and the fourth electrode is coupled to the second terminal.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.