US 5,544,412 A · Method for coupling a power lead to a bond pad in an electronic module

Abstract

An electronic module and a method for coupling a power lead (32) to a bond pad (28) on a semiconductor die (17) within the electronic module. A clip support (13) having a slot (27) is coupled to a baseplate (11) via an isolation structure (14). The semiconductor die (17) is coupled to the baseplate (11) via an isolation structure (19). The power lead (32) is coupled to the isolation structure (14). The clip support (13) is coupled to the semiconductor die (17) via a clip (29), wherein a first end of the clip (29) is inserted in the slot (27) and a second end of the clip (29) is compressively mated with the semiconductor die (17). Compressively mating the clip (29) with the semiconductor die (17) eliminates the need for bond feet, thereby increasing the reliability of the module.

Claims20

Dependent claims

A method for coupling a power lead to a bond pad in an electronic module, comprising the steps of:

forming a baseplate having a top surface and a bottom surface;
mounting at least one isolation structure to the top surface, the at least one isolation structure having a first region electrically isolated from a second region;
mounting a first clip support to the first region of the at least one isolation structure, wherein the first clip support is coupled to the first portion of the top surface by the at least one isolation structure;
coupling the bond pad to the second region of the at least one isolation structure;
electrically coupling the power lead to the first clip support;
and
electrically coupling the first clip support to the bond pad with a clip, wherein the power lead becomes electrically coupled to the bond pad, and wherein the first clip support and the first and second regions of the at least one isolation structure are electrically conductive.

4 more elements

A method for coupling a power lead to a bond pad in an electronic module, comprising the steps of:

forming a porous baseplate having a top surface and a bottom surface;
forming at least one porous clip support, the at least one porous clip support having a notch for mating with a clip;
covering a first portion of the top surface with a first layer of dielectric material;
placing the at least one clip support on a first portion of the first layer of dielectric material;
impregnating the porous baseplate and the porous clip support with a conductive material, wherein the step of impregnating bonds the porous baseplate and the porous clip support to the first layer of dielectric material;
coupling the bond pad to a second portion of the top surface;
electrically coupling the power lead to the porous first clip support that is impregnated with the conductive material;
and
compressively coupling the clip to the at least one porous clip support and bond pad, wherein the power lead becomes electrically coupled to the bond pad.

6 more elements

A method for coupling a power lead to a bond pad in an electronic module, comprising the steps of:

forming a baseplate having a top surface and a bottom surface;
mounting first and second isolation structures to first and second portions of the top surface, respectively;
mounting a first clip support to the first isolation structure, wherein the first clip support is coupled to a first portion of the top surface by the isolation structure;
coupling the bond pad to the second isolation structure;
electrically coupling the power lead to the first clip support;
and
electrically coupling the first clip support to the bond pad with a clip, wherein the power lead becomes electrically coupled to the bond pad.

4 more elements

Dependencies are inferred from the claim text.

Method for coupling a power lead to a bond pad in an electronic module

Life of this patent

Method for coupling a power lead to a bond pad in an electronic module

Life of this patent

Abstract

Claims20