H10W 72/856
Bump connectors and die-attach connectors
Official title: {Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)}
H10W72/856 (Bump connectors and die-attach connectors) appears on 3,017 US grants and 2,930 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,017
- Published applications
- 2,930
- Assignees
- 576
- Inventors
- 4,674
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 9 | 0 |
| 1992 | 14 | 0 |
| 1993 | 12 | 0 |
| 1994 | 16 | 0 |
| 1995 | 25 | 0 |
| 1996 | 28 | 0 |
| 1997 | 35 | 0 |
| 1998 | 68 | 0 |
| 1999 | 101 | 0 |
| 2000 | 103 | 0 |
| 2001 | 171 | 78 |
| 2002 | 162 | 209 |
| 2003 | 181 | 181 |
| 2004 | 160 | 207 |
| 2005 | 146 | 221 |
| 2006 | 144 | 207 |
| 2007 | 125 | 235 |
| 2008 | 120 | 207 |
| 2009 | 131 | 164 |
| 2010 | 154 | 155 |
| 2011 | 147 | 148 |
| 2012 | 121 | 106 |
| 2013 | 128 | 82 |
| 2014 | 116 | 75 |
| 2015 | 72 | 69 |
| 2016 | 70 | 57 |
| 2017 | 62 | 46 |
| 2018 | 41 | 43 |
| 2019 | 51 | 67 |
| 2020 | 61 | 92 |
| 2021 | 48 | 55 |
| 2022 | 48 | 50 |
| 2023 | 44 | 36 |
| 2024 | 31 | 64 |
| 2025 | 36 | 46 |
| 2026 | 22 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Three-dimensional device package with carrier substrate and thermal vias29 Sep 2026US 12,751,288 B1Marvel Asia Pte Ltd
- Chip packaging method and chip packaging structure15 Sep 2026US 12,740,461 B2Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Semiconductor package15 Sep 2026US 12,740,488 B2Samsung Electronics Co., Ltd.
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Semiconductor device18 Aug 2026US 12,713,913 B2Dynex Semiconductor Limited
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Memory-only cubes and methods of forming the same1 Oct 2026US 2026/0305497 A1Micron Technology, Inc.
- Semiconductor package including heat dissipation layers24 Sep 2026US 2026/0293672 A1Samsung Electronics Co., Ltd.
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
Most cited
By later US patents
- Surface acoustic wave device mounted module473US 5,459,368 AMatsushita Electric Industrial Co., Ltd. · 1995
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997