H10W 72/874
On different surfaces
Official title: {On different surfaces}
H10W72/874 (On different surfaces) appears on 31,052 US grants and 34,464 published applications in this corpus.
Search patents in H10W- Granted patents
- 31,052
- Published applications
- 34,464
- Assignees
- 3,160
- Inventors
- 33,832
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 12 | 0 |
| 1978 | 13 | 0 |
| 1979 | 5 | 0 |
| 1980 | 6 | 0 |
| 1981 | 10 | 0 |
| 1982 | 15 | 0 |
| 1983 | 16 | 0 |
| 1984 | 19 | 0 |
| 1985 | 32 | 0 |
| 1986 | 26 | 0 |
| 1987 | 36 | 0 |
| 1988 | 46 | 0 |
| 1989 | 64 | 0 |
| 1990 | 76 | 0 |
| 1991 | 96 | 0 |
| 1992 | 115 | 0 |
| 1993 | 115 | 0 |
| 1994 | 165 | 0 |
| 1995 | 165 | 0 |
| 1996 | 164 | 0 |
| 1997 | 176 | 0 |
| 1998 | 311 | 0 |
| 1999 | 352 | 0 |
| 2000 | 377 | 0 |
| 2001 | 490 | 220 |
| 2002 | 549 | 744 |
| 2003 | 610 | 815 |
| 2004 | 703 | 998 |
| 2005 | 691 | 1216 |
| 2006 | 764 | 1207 |
| 2007 | 807 | 1371 |
| 2008 | 741 | 1448 |
| 2009 | 800 | 1445 |
| 2010 | 1182 | 1409 |
| 2011 | 1308 | 1449 |
| 2012 | 1234 | 1579 |
| 2013 | 1352 | 1576 |
| 2014 | 1447 | 1660 |
| 2015 | 1642 | 1824 |
| 2016 | 1685 | 1606 |
| 2017 | 1625 | 1578 |
| 2018 | 1426 | 1435 |
| 2019 | 1461 | 1573 |
| 2020 | 1425 | 1871 |
| 2021 | 1364 | 1733 |
| 2022 | 1344 | 1714 |
| 2023 | 1319 | 1222 |
| 2024 | 1195 | 1212 |
| 2025 | 974 | 1004 |
| 2026 | 494 | 555 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/884Die-attach connectors and bond wires21,324
- H10W 72/877Bump connectors and die-attach connectors6,566
- H10W 72/879Bump connectors and bond wires950
- H10W 72/886Die-attach connectors and strap connectors659
- H10W 72/881Bump connectors and strap connectors77
- H10W 72/889Bond wires and strap connectors28
Recent patents
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- Semiconductor device6 Oct 2026US 12,757,766 B2Rohm Co., Ltd.
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- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
Most cited
By later US patents
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- H-bridge drive utilizing a pair of high and low side MOSFETs in a common insulation housing1,067US 6,747,300 B2Ternational Rectifier Corporation · 2004
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999