H10W 72/889
Bond wires and strap connectors
Official title: {Bond wires and strap connectors}
H10W72/889 (Bond wires and strap connectors) appears on 28 US grants and 40 published applications in this corpus.
Search patents in H10W- Granted patents
- 28
- Published applications
- 40
- Assignees
- 18
- Inventors
- 114
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 2 |
| 2013 | 0 | 0 |
| 2014 | 1 | 3 |
| 2015 | 2 | 6 |
| 2016 | 3 | 1 |
| 2017 | 3 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 2 |
| 2020 | 1 | 2 |
| 2021 | 4 | 3 |
| 2022 | 1 | 5 |
| 2023 | 4 | 3 |
| 2024 | 2 | 4 |
| 2025 | 4 | 2 |
| 2026 | 0 | 4 |
By publication year. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Method for fabricating stack die package23US 9,589,929 B2Vishay-Siliconix · 2017
- Stacked die power converter8US 9,842,797 B2Texas Instruments Incorporated · 2017
- Stacked synchronous buck converter having chip embedded in outside recess of leadframe6US 9,184,121 B2Texas Instruments Incorporated · 2015
- Method for fabricating stack die package4US 10,546,840 B2Vishay-Siliconix · 2020
- Flip chip semiconductor device4US 8,669,650 B2Alpha and Omega Semiconductor Incorporated · 2014