Electronic device topside cooling
AssigneeTexas Instruments Incorporated
InventorsLaura May Antoinette Dela Paz Clemente, James Raymond Maliclic Baello
Life of this patent
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Abstract
A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.
Claims21
A method, comprising:
- performing a laser ablation process that removes a portion of molding compound from a side of a package structure to create an opening that exposes a portion of a conductive clip;
- depositing solder paste on the exposed portion of the conductive clip;
- and
- reflowing the solder paste.
A method, comprising:
- forming a semiconductor die having an electronic component;
- attaching a conductive clip on a side of the semiconductor die;
- forming a solder structure on a side of the conductive clip;
- and
- enclosing the semiconductor die and the conductive clip with a package structure, the package structure having a side that exposes a portion of the solder structure.
A method of making an electronic device, comprising:
- forming a package structure having a first side that includes an opening, and an opposite second side;
- forming a solder structure in the opening, the solder structure exposed along the first side of the package structure;
- providing a die attach pad having a first side exposed along the second side of the package structure;
- exposing a first lead along the second side of the package structure;
- exposing a second lead along the second side of the package structure;
- coupling a first transistor having a drain to the solder structure and to the second lead, and a source coupled to the first lead;
- and
- coupling a drain of a second transistor to the first lead, and a source to the die attach pad.
A method, comprising:
- forming a package structure having a first side that includes an opening, and an opposite second side;
- forming a solder structure in the opening, the solder structure exposed along the first side of the package structure;
- providing a die attach pad having a first side exposed along the second side of the package structure;
- exposing a first lead along the second side of the package structure;
- exposing a second lead along the second side of the package structure;
- forming a first transistor having a drain coupled to the solder structure and to the second lead, and a source coupled to the first lead;
- forming a second transistor having a drain coupled to the first lead, and a source coupled to the die attach pad;
- and
- forming a control circuit in the package structure, the control circuit having a first output coupled to a gate of the first transistor, and a second output coupled to a gate of the second transistor.
A method of making an electronic device, comprising:
- forming a package structure having an opening exposing a portion of a conductive clip;
- and
- forming a solder structure on the exposed portion of the conductive clip from the conductive clip to a surface of the package structure.
A method, comprising:
- forming a semiconductor die having an electronic component;
- attaching a conductive clip on a side of the semiconductor die;
- forming a solder structure on a side of the conductive clip;
- and
- covering the semiconductor die and the conductive clip with a package structure, the package structure having a side that exposes a portion of the solder structure.
Dependencies are inferred from the claim text.