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US 12,230,615 B2Granted
Semiconductor packages with vertical passive components
AssigneeUTAC Headquarters Pte. Ltd.
InventorsJiraphat Charoenratpratoom, Phongsak Sawasdee, Wannasat Panphrom
Life of this patent
Estimating the term…
Abstract
An embodiment related to a package is disclosed. The package includes a component mounted to a die attach region on a package substrate. A passive component with first and second passive component terminals is vertically attached to the package substrate. An encapsulant is disposed over the package substrate to encapsulate the package. In one embodiment, an external component is stacked above the encapsulant and is electrically coupled to the encapsulated package.
Claims20
A device comprising:
- a package substrate having top and bottom major package substrate surfaces, the top major package substrate surface includes an active package surface configured with a component attach region and terminal pads;
- a component mounted onto the component attach region of the active package surface, the component is electrically coupled to the terminal pads;
- a passive component with opposing first and second passive component terminals, wherein the passive component is attached to the package substrate in a vertical configuration comprising,
- the first passive component terminal attached to one terminal pad of the terminal pads, and
- the second passive component terminal is distal from the top major package substrate surface;
- and
- an encapsulant, the encapsulant forms an encapsulated package.
4 more elements
A method for forming a device comprising:
- providing a package substrate having top and bottom major package substrate surfaces, the top major package substrate surface includes an active package surface configured with a component attach region and terminal pads;
- disposing a component on the component attach region, the component is electrically coupled to the terminal pads;
- attaching a passive component with opposing first and second passive component terminals to the package substrate, wherein the first passive component terminal is attached to the package substrate in a vertical configuration comprising,
- the first passive component terminal attached to one terminal pad of the terminal pads, and
- the second passive component terminal is distal from the top major package substrate surface;
- and
- depositing an encapsulant, the encapsulant forms an encapsulated package.
4 more elements
A device comprising:
- a package substrate having top and bottom major package substrate surfaces, the top major package substrate surface includes a component mounting region and terminal pads;
- a component attached to the component mounting region, wherein the component includes component pads connected to the terminal pads;
- and
- a passive component with opposing first and second passive component terminals, wherein the passive component is attached to the package substrate in a vertical configuration comprising,
- the first passive component terminal attached to one terminal pad of the terminal pads, and
- the second passive component terminal is distal from the top major package substrate surface.
3 more elements
Dependencies are inferred from the claim text.