Semiconductor package having capacitors and two or more driver devices and method of making the same

A method for fabricating a semiconductor package, the method comprising the steps of:

• providing a lead frame comprising
• a first die paddle;
• and
• a second die paddle;
• attaching two or more low side field-effect transistor (FET) chips to the first die paddle, each low side FET chip of the two or more low side FET chips being flipped, said each low side FET chip of the two or more low side FET chips comprising:
• a source electrode and a gate electrode on a top surface of said each low side FET chip of the two or more low side FET chips, and
• a drain electrode on a bottom surface of said each low side FET chip of the two or more low side FET chips,
• attaching two or more high side FET chips to the second die paddle, each high side FET chip of the two or more high side FET chips comprising:
• a source electrode and a gate electrode on a top surface of said each high side FET chip of the two or more high side FET chips, and
• a drain electrode on a bottom surface of said each high side FET chip of the two or more high side FET chips;
• mounting two or more metal clips so as to connect the drain electrode of a respective low side FET chip of the two or more low side FET chips to the source electrode of a respective high side FET chip of the two or more high side FET chips by each metal clip of two or more metal clips;
• attaching a first capacitor, a second capacitor, and an input capacitor to the lead frame;
• connecting said each metal clip of the two or more metal clips to an integrated circuit (IC) chip positioned above the two or more high side FET chips;
• applying a wire bonding process;
• forming a molding encapsulation enclosing the two or more low side FET chips, the two or more high side FET chips, the two or more metal clips, the IC chip, and a majority portion of the lead frame;
• and
• applying a singulation process separating the semiconductor package from adjacent semiconductor packages.