Semiconductor device and electronic device

An electronic device comprising:

• a wiring board having wiring;
• and
• a semiconductor device mounted on the wiring board and including:
• a first semiconductor element having two electrodes respectively disposed on two surfaces of the first semiconductor element;
• a second semiconductor element having two electrodes respectively disposed on two surfaces of the second semiconductor element;
• two first terminals connected to a part of the wiring of the wiring board, electrically connected to the two electrodes of the first semiconductor element, respectively, and arranged side by side in one direction;
• two second terminals connected to another part of the wiring of the wiring board, electrically connected to the two electrodes of the second semiconductor element, respectively, and arranged side by side in the one direction to be adjacent to the two first terminals;
• and
• a sealing resin portion covering the first semiconductor element, the second semiconductor element, the first terminals, and the second terminals in a state where facing surfaces of the first terminals and the second terminals that face the wiring board are exposed from the sealing resin portion, wherein
• the facing surfaces of the two first terminals have area ratios different from each other,
• the facing surfaces of the two second terminals have area ratios different from each other, and
• one of the first terminals is arranged adjacent to both the two second terminals.

An electronic device comprising:

• a wiring board having wiring;
• a capacitor disposed on the wiring board;
• and
• a semiconductor device mounted on the wiring board and including:
• a first semiconductor element having a front surface and a rear surface, and having a front surface electrode disposed on the front surface and a rear surface electrode disposed on the rear surface;
• a second semiconductor element having a front surface and a rear surface, and having a front surface electrode disposed on the front surface and a rear surface electrode disposed on the rear surface;
• a first rear surface terminal facing and connected to the rear surface electrode of the first semiconductor element, and a first front surface terminal connected to the front surface electrode of the first semiconductor element via a first bridge member, the first rear surface terminal and the first front surface terminal connected to a part of the wiring of the wiring board and arranged side by side in one direction;
• a second rear surface terminal facing and connected to the rear surface electrode of the second semiconductor element, and a second front surface terminal connected to the front surface electrode of the second semiconductor element via a second bridge member, the second rear surface terminal and the second front surface terminal connected to another part of the wiring of the wiring board and arranged side by side in the one direction;
• and
• a sealing resin portion covering the first semiconductor element, the second semiconductor element, the first front surface terminal, the first rear surface terminal, the second front surface terminal, and the second rear surface terminal in a state where facing surfaces of the first front surface terminal, the first rear surface terminal, the second front surface terminal, and the second rear surface terminal that face the wiring board are exposed from the sealing resin portion, wherein
• the facing surface of the first front surface terminal and the facing surface of the first rear surface terminal have area ratios different from each other,
• the facing surface of the second front surface terminal and the facing surface of the second rear surface terminal have area ratios different from each other,
• the first rear surface terminal and the second front surface terminal are arranged adjacent to each other and respectively connected to terminals of the capacitor,
• the second rear surface terminal and the first front surface terminal are arranged adjacent to each other, and
• the first front surface terminal or the first rear surface terminal is arranged adjacent to both the second front surface terminal and the second rear surface terminal.