H10W 72/877

Bump connectors and die-attach connectors

Official title: {Bump connectors and die-attach connectors}

H10W72/877 (Bump connectors and die-attach connectors) appears on 6,566 US grants and 7,426 published applications in this corpus.

Search patents in H10W
Granted patents
6,566
Published applications
7,426
Assignees
917
Inventors
9,240
Latest grant
6 Oct 2026

Filings by year

H10W 72/877: granted patents and published applications per publication year
YearGranted patentsPublished applications
197720
197830
197900
198020
198130
198220
198300
198430
198520
198630
198740
198880
1989120
1990160
1991160
1992140
1993240
1994350
1995260
1996280
1997270
1998650
1999800
2000720
20019744
2002118157
2003124180
2004154274
2005181297
2006206294
2007199302
2008171288
2009186280
2010251215
2011220220
2012199269
2013243281
2014235300
2015313361
2016346322
2017343309
2018291311
2019276351
2020326473
2021323441
2022328384
2023353283
2024288338
2025213292
2026135160

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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