H10W 72/884
Die-attach connectors and bond wires
Official title: {Die-attach connectors and bond wires}
H10W72/884 (Die-attach connectors and bond wires) appears on 21,324 US grants and 23,309 published applications in this corpus.
Search patents in H10W- Granted patents
- 21,324
- Published applications
- 23,309
- Assignees
- 2,553
- Inventors
- 25,685
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 10 | 0 |
| 1978 | 10 | 0 |
| 1979 | 5 | 0 |
| 1980 | 3 | 0 |
| 1981 | 6 | 0 |
| 1982 | 12 | 0 |
| 1983 | 16 | 0 |
| 1984 | 13 | 0 |
| 1985 | 29 | 0 |
| 1986 | 23 | 0 |
| 1987 | 31 | 0 |
| 1988 | 35 | 0 |
| 1989 | 48 | 0 |
| 1990 | 56 | 0 |
| 1991 | 76 | 0 |
| 1992 | 95 | 0 |
| 1993 | 90 | 0 |
| 1994 | 119 | 0 |
| 1995 | 132 | 0 |
| 1996 | 128 | 0 |
| 1997 | 142 | 0 |
| 1998 | 238 | 0 |
| 1999 | 263 | 0 |
| 2000 | 293 | 0 |
| 2001 | 393 | 177 |
| 2002 | 429 | 595 |
| 2003 | 475 | 627 |
| 2004 | 544 | 714 |
| 2005 | 495 | 881 |
| 2006 | 547 | 891 |
| 2007 | 588 | 1036 |
| 2008 | 555 | 1086 |
| 2009 | 583 | 1108 |
| 2010 | 899 | 1137 |
| 2011 | 1022 | 1154 |
| 2012 | 968 | 1235 |
| 2013 | 1056 | 1219 |
| 2014 | 1116 | 1220 |
| 2015 | 1223 | 1290 |
| 2016 | 1223 | 1137 |
| 2017 | 1128 | 1040 |
| 2018 | 915 | 906 |
| 2019 | 944 | 932 |
| 2020 | 830 | 966 |
| 2021 | 718 | 878 |
| 2022 | 696 | 955 |
| 2023 | 667 | 669 |
| 2024 | 636 | 646 |
| 2025 | 521 | 509 |
| 2026 | 273 | 301 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Semiconductor device6 Oct 2026US 12,757,766 B2Rohm Co., Ltd.
- Semiconductor module arrangement6 Oct 2026US 12,757,794 B2Infineon Technologies AG
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
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- H-bridge drive utilizing a pair of high and low side MOSFETs in a common insulation housing1,067US 6,747,300 B2Ternational Rectifier Corporation · 2004
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000