H10W 72/879
Bump connectors and bond wires
Official title: {Bump connectors and bond wires}
H10W72/879 (Bump connectors and bond wires) appears on 950 US grants and 1,063 published applications in this corpus.
Search patents in H10W- Granted patents
- 950
- Published applications
- 1,063
- Assignees
- 304
- Inventors
- 1,922
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 7 | 0 |
| 1997 | 8 | 0 |
| 1998 | 12 | 0 |
| 1999 | 13 | 0 |
| 2000 | 12 | 0 |
| 2001 | 12 | 4 |
| 2002 | 9 | 24 |
| 2003 | 16 | 12 |
| 2004 | 15 | 33 |
| 2005 | 28 | 33 |
| 2006 | 22 | 27 |
| 2007 | 21 | 36 |
| 2008 | 14 | 52 |
| 2009 | 19 | 37 |
| 2010 | 34 | 41 |
| 2011 | 38 | 49 |
| 2012 | 52 | 52 |
| 2013 | 35 | 47 |
| 2014 | 55 | 54 |
| 2015 | 43 | 60 |
| 2016 | 47 | 44 |
| 2017 | 62 | 63 |
| 2018 | 49 | 48 |
| 2019 | 45 | 55 |
| 2020 | 50 | 59 |
| 2021 | 39 | 48 |
| 2022 | 49 | 57 |
| 2023 | 46 | 29 |
| 2024 | 33 | 33 |
| 2025 | 22 | 40 |
| 2026 | 20 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structures, fabricating methods thereof, and memory systems22 Sep 2026US 12,745,666 B2Yangtze Memory Technologies Co., Ltd.
- Semiconductor package15 Sep 2026US 12,740,482 B2Samsung Electronics Co., Ltd.
- Semiconductor package including package cap8 Sep 2026US 12,733,488 B2Samsung Electronics Co., Ltd.
- Offset interposers for large-bottom packages and large-die package-on-package structures8 Sep 2026US 12,733,556 B2Intel Corporation
- Methods related to dual-sided radio-frequency package with overmold structure25 Aug 2026US 12,721,179 B2Skyworks Solutions, Inc.
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor package including antenna substrate and manufacturing method thereof1 Oct 2026US 2026/0302594 A1Advanced Semiconductor Engineering, Inc.
- Memory package and memory module including the memory package17 Sep 2026US 2026/0282397 A1SK hynix Inc.
- Semiconductor package and manufacturing method thereof27 Aug 2026US 2026/0255990 A1Orient Semiconductor Electronics Limited
- Radio frequency (rf) interconnect configuration for substrate and surface mount device27 Aug 2026US 2026/0255997 A1Ciena Corporation
Most cited
By later US patents
- Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof505US 6,962,867 B2MicronTechnology, Inc. · 2005
- Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies495US 6,800,930 B2Micron Technology, Inc. · 2004
- Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film369US 5,200,362 AMotorola, Inc. · 1993
- Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods360US 7,355,273 B2Micron Technology, Inc. · 2008
- Overmolded semiconductor device having solder ball and edge lead connective structure334US 5,239,198 AMotorola, Inc. · 1993